LED heat sinks for heat dissipation and electronic circuit board heat dissipation at home and abroad generally use aluminum-based copper-clad laminate as the substrate of the circuit board. Since the aluminum plate replaces the non-metallic reinforcing material in the ordinary printed circuit board, the whole circuit board becomes one. The huge heat sink not only accelerates the heat dissipation generated by the circuit work, but also eliminates the need to install a heat sink in the circuit, thereby reducing the installation space of the printed circuit assembly board. At the same time, aluminum has the characteristics of small specific gravity, high thermal conductivity and good ductility. Therefore, the successful development of aluminum-based copper-clad laminate is a major revolution in the development of printed circuit boards, becoming a high-power power supply board (module). The sought-after materials of LED photovoltaic panels (modules) have won wide market demand as soon as they are available.
Metal-clad laminate structure and working principle Metal-based copper-clad laminate structure is generally composed of a metal base layer (a metal sheet such as aluminum or copper), an insulating heat conductive layer (epoxy resin, ceramic powder, etc.) and copper foil (electrolysis) Copper foil, rolled copper foil, etc.). At present, the most widely used is an aluminum-based copper clad laminate. Aluminum-based copper-clad laminate aluminum-based copper-clad laminate works: LED power device is mounted on the printed circuit layer, and the heat generated by the LED power device is quickly transferred to the metal (aluminum) substrate through the insulating layer. Then, the metal (aluminum) base layer transfers heat to the heat sink to dissipate the heat, thereby realizing the manufacturing process of the LED power high-power LED heat sink-based copper-clad printed circuit laminate.
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